LFE2-12SE-7FN256C OverviewFpga chips is supplied in the 256-BGA package. Fpga chips is programmed wFpga chipsh 193 I/Os for transferring data in a more coherent manner. There are 12000 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the ECP2 seies. The operating temperature should be kept at 0°C~85°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 226304. Its base part number LFE2-12 can be used to find related parts. The RAM si27.6kBe of this FPGA module reaches 27.6kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 256 pins. This FPGA is built as an array of 1500 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 85°C. The operating temperature should be higher than 0°C. Its basic building block is composed of 1500 logic blocks (LABs). This FPGA module embeds a memory of 30.6kB available for storing programs and data. This FPGA can get as fast as 320MHz. It employs 256-FPBGA (17x17) as its supplier device package.
LFE2-12SE-7FN256C Features193 I/Os
Up to 226304 RAM bits
256 LABs/CLBs
85°C gates
1500 logic blocks (LABs)
LFE2-12SE-7FN256C ApplicationsThere are a lot of Lattice Semiconductor Corporation
LFE2-12SE-7FN256C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Factory Lead Time | 8 Weeks |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 256-BGA |
Number of Pins | 256 |
Supplier Device Package | 256-FPBGA (17x17) |
Operating Temperature | 0°C~85°C TJ |
Packaging | Tray |
Series | ECP2 |
Published | 2012 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Max Operating Temperature | 85°C |
Min Operating Temperature | 0°C |
Voltage - Supply | 1.14V~1.26V |
Base Part Number | LFE2-12 |
Operating Supply Voltage | 1.2V |
Memory Size | 30.6kB |
Number of I/O | 193 |
RAM Size | 27.6kB |
Number of Logic Elements/Cells | 12000 |
Total RAM Bits | 226304 |
Max Frequency | 320MHz |
Number of LABs/CLBs | 1500 |
Number of Logic Blocks (LABs) | 1500 |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |