LFXP10E-3FN256C Overview
A 256-BGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 188 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 10000 logic elements/cells. An electrical supply voltage of 1.2V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the XP series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 188 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 256 terminations. The RAM bits that are offered by this fpga chips are 221184. Related parts can be found by using its base part number LFXP10. The FPGA module's RAM si27kBe reaches 27kB in order to ensure that the program operates in a normal manner. 256 pins are designed into the device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.2V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 4 gates that are included in it. In addition to this, it has 256 pins. 1250 logic blocks (LABs) make up its basic building blocks. There is a memory of 31.9kB embedded in this FPGA module, which can be used for storing programs and data. In its architecture, there are 1216 CLB modules. This device operates at a frequency of 320MHz in order to provide high efficiency. In order for the building block to work, fpga semiconductor consists of 1216 logic cells.
LFXP10E-3FN256C Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)
Operating from a frequency of 320MHz

LFXP10E-3FN256C Applications
There are a lot of Lattice Semiconductor Corporation
LFXP10E-3FN256C FPGAs applications.

Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive

Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	256-BGA
Number of Pins	256
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	XP
Published	2007
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply	1.14V~1.26V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	250
Supply Voltage	1.2V
Terminal Pitch	1mm
Frequency	320MHz
Time@Peak Reflow Temperature-Max (s)	40
Base Part Number	LFXP10
Pin Count	256
Number of Outputs	188
Qualification Status	Not Qualified
Operating Supply Voltage	1.2V
Memory Size	31.9kB
Number of I/O	188
RAM Size	27kB
Organization	1216 CLBS
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	10000
Total RAM Bits	221184
Number of Gates	4
Number of Logic Blocks (LABs)	1250
Combinatorial Delay of a CLB-Max	0.63 ns
Number of CLBs	1216
Number of Logic Cells	1216
Length	17mm
Height Seated (Max)	2.1mm
Width	17mm
RoHS Status	RoHS Compliant
Lead Free	Lead Free