LS1023ASN8PQB Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 780-FBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 2 Core 64-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C. In the QorIQ® Layerscape series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR3L, DDR4 RAM controllers are used by this CPU.
LS1023ASN8PQB Features
ARM® Cortex®-A53 Core

LS1023ASN8PQB Applications
There are a lot of NXP USA Inc.
LS1023ASN8PQB Microprocessor applications.

Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Operating Temperature	0°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2014
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.4GHz
Core Processor	ARM® Cortex®-A53
Ethernet	1GbE (7) or 10GbE (1) & 1GbE (5)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR3L, DDR4
USB	USB 3.0 (2) + PHY
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
RoHS Status	ROHS3 Compliant