MCIMX6D7CVT08AC,NXP USA Inc. MCIMX6D7CVT08AC supplier,NXP USA Inc. MCIMX6D7CVT08AC priceIntegrated Circuits (ICs)
MCIMX6D7CVT08AC,NXP USA Inc. MCIMX6D7CVT08AC supplier,NXP USA Inc. MCIMX6D7CVT08AC priceIntegrated Circuits (ICs)
MCIMX6D7CVT08AC
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MCIMX6D7CVT08AC
    Part Number:KY-MCIMX6D7CVT08AC
    Mfr. Part No:MCIMX6D7CVT08AC
    Mfr.:NXP USA Inc.
    Stock:1698
    Description: 0.8mm ARM® Cortex®-A9 64-bit Microprocessor i.MX6D Series MCIMX6 624-FBGA, FCBGA
    Data Sheet:MCIMX6D7CVT08AC Datasheet
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  • MCIMX6D7CVT08AC Description


    The MCIMX6D7CVT08AC Dual processor represents the latest achievement in integrated multimedia applications processors. This processor is part of a growing family of multimedia-focused products that offer high-performance processing and are optimized for the lowest power consumption. The MCIMX6D7CVT08AC features advanced implementation of the quad Arm? Cortex?-A9 core, which operates at speeds up to 800 MHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. The MCIMX6D7CVT08AC applications processor combines scalable platforms with broad levels of integration and power-efficient processing capabilities particularly suited to multimedia applications. 



    MCIMX6D7CVT08AC Features


    • Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and games


    • Multilevel memory system


    • Smart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations


    • Dynamic voltage and frequency scaling


    • Powerful graphics acceleration


    • Interface flexibility


    • Integrated power management throughout the device


    • Advanced hardware-enabled security




      MCIMX6D7CVT08AC Applications


      • Heating Ventilation, and Air Conditioning (HVAC)


      • Instrument Cluster


      • 3-Phase AC Induction Motor


      • Air Conditioning (AC)


      • Brushless DC Motor (BLDC) Control


      • Fleet Management


      • Smart Watch



        Package / Case624-FBGA, FCBGA
        Surface MountYES
        Operating Temperature-40°C~105°C TA
        PackagingTray
        Seriesi.MX6D
        Published2002
        JESD-609 Codee1
        Part StatusNot For New Designs
        Moisture Sensitivity Level (MSL)3 (168 Hours)
        Number of Terminations624
        ECCN Code5A992
        Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
        HTS Code8542.31.00.01
        Terminal PositionBOTTOM
        Terminal FormBALL
        Peak Reflow Temperature (Cel)260
        Terminal Pitch0.8mm
        Time@Peak Reflow Temperature-Max (s)40
        Base Part NumberMCIMX6
        JESD-30 CodeS-PBGA-B624
        Supply Voltage-Max (Vsup)1.5V
        Supply Voltage-Min (Vsup)1.275V
        Speed800MHz
        uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
        Core ProcessorARM® Cortex®-A9
        Clock Frequency24MHz
        Bit Size64
        Address Bus Width16
        Boundary ScanYES
        Low Power ModeYES
        External Data Bus Width64
        FormatFIXED POINT
        Integrated CacheYES
        Voltage - I/O1.8V 2.5V 2.8V 3.3V
        Ethernet10/100/1000Mbps (1)
        Number of Cores/Bus Width2 Core 32-Bit
        Graphics AccelerationYes
        RAM ControllersLPDDR2, LVDDR3, DDR3
        USBUSB 2.0 + PHY (4)
        Additional InterfacesCAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
        Co-Processors/DSPMultimedia; NEON™ SIMD
        Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
        Display & Interface ControllersKeypad, LCD
        SATASATA 3Gbps (1)
        Length21mm
        Height Seated (Max)2.16mm
        RoHS StatusROHS3 Compliant
    
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