TE0808-04-09EG-1EK,Trenz Electronic GmbH TE0808-04-09EG-1EK supplier,Trenz Electronic GmbH TE0808-04-09EG-1EK priceIntegrated Circuits (ICs)
TE0808-04-09EG-1EK,Trenz Electronic GmbH TE0808-04-09EG-1EK supplier,Trenz Electronic GmbH TE0808-04-09EG-1EK priceIntegrated Circuits (ICs)
TE0808-04-09EG-1EK
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TE0808-04-09EG-1EK
    Part Number:KY-TE0808-04-09EG-1EK
    Mfr. Part No:TE0808-04-09EG-1EK
    Mfr.:Trenz Electronic GmbH
    Stock:12084
    Description: MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0808 2GB
    Data Sheet:TE0808-04-09EG-1EK Datasheet
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  • TE0808-04-09EG-1EK Overview
    In this case, the module or board type of the microcontroller is MPU Core.With Zynq UltraScale+ XCZU9EG-1FFVC900E cores, the processor drives microprocessor chip.In order to use the microcontroller, the default setting is 0°C~85°C.The size of the flash on the MCU electronics is 128MB.The connector type B2B refers to the connector type.The TE0808 Series is the group in which MCU chip belongs.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.
    TE0808-04-09EG-1EK Features
    Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
    Flash size of 128MB

    TE0808-04-09EG-1EK Applications
    There are a lot of Trenz Electronic GmbH
    TE0808-04-09EG-1EK Microcontroller, Microprocessor, FPGA Modules applications.

    Data Acquisition
    Industrial Control
    Process Control
    Process Monitoring
    Healthcare Monitoring
    Patient Monitoring
    IoT Secure Gateways
    Human Machine Interface
    Human Machine Control Panel
    Home and Building Automation
    Operating Temperature0°C~85°C
    SeriesTE0808
    Size / Dimension2.05 x 2.99 52mmx76mm
    Part StatusObsolete
    Moisture Sensitivity Level (MSL)1 (Unlimited)
    Connector TypeB2B
    RAM Size2GB
    Core ProcessorZynq UltraScale+ XCZU9EG-1FFVC900E
    Module/Board TypeMPU Core
    Flash Size128MB
    RoHS StatusROHS3 Compliant
    
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