XC3S2000-4FG456C,Xilinx Inc. XC3S2000-4FG456C price,Integrated Circuits (ICs) XC3S2000-4FG456C Distributor,XC3S2000-4FG456C supplier
XC3S2000-4FG456C,Xilinx Inc. XC3S2000-4FG456C price,Integrated Circuits (ICs) XC3S2000-4FG456C Distributor,XC3S2000-4FG456C supplier
XC3S2000-4FG456C
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XC3S2000-4FG456C
    Part Number:KY-XC3S2000-4FG456C
    Mfr. Part No:XC3S2000-4FG456C
    Mfr.:Xilinx Inc.
    Stock:721
    Description: 1.2V V FPGAs Spartan®-3 Series 456-BBGA
    Data Sheet:XC3S2000-4FG456C Datasheet
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  • XC3S2000-4FG456C Overview
    The package that contains this software is called 456-BBGA. There are 333 I/Os for better data transfer. In order to construct a fundamental building block, 46080 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-3 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. As far as the RAM bits are concerned, this device offers you a total of 737280. For the program to work properly, the RAM si90kBe of this FPGA module must reach 90kB GB in order to ensure normal operation. 5120 LABs/CLBs are configured on this FPGA. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 2000000 gates. The supplier of the device package is 456-FBGA (23x23).
    XC3S2000-4FG456C Features
    333 I/Os
    Up to 737280 RAM bits
    85°C gates

    XC3S2000-4FG456C Applications
    There are a lot of Xilinx Inc.
    XC3S2000-4FG456C FPGAs applications.

    Random logic
    ASIC prototyping
    Medical imaging
    Computer hardware emulation
    Integrating multiple SPLDs
    Voice recognition
    Cryptography
    Filtering and communication encoding
    Aerospace and Defense
    Medical Electronics
    Factory Lead Time10 Weeks
    Mounting TypeSurface Mount
    Package / Case456-BBGA
    Supplier Device Package456-FBGA (23x23)
    Operating Temperature0°C~85°C TJ
    PackagingBulk
    SeriesSpartan®-3
    Published2009
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature85°C
    Min Operating Temperature0°C
    Voltage - Supply1.14V~1.26V
    Operating Supply Voltage1.2V
    Number of I/O333
    RAM Size90kB
    Number of Logic Elements/Cells46080
    Total RAM Bits737280
    Number of Gates2000000
    Number of LABs/CLBs5120
    Speed Grade4
    RoHS StatusNon-RoHS Compliant
    
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