This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 780-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Arria 10 SX is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines FPGA - 270K Logic Elements and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 360 I/Os in total.A power supply with a 0.9V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 0.93V.As a minimum, the power supply of the SoC system on a chip needs to be 0.87V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 780 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 360 outputs.In order to use system on chip, you will need a power supply of 0.9V.This SoC chip is equipped with 360 inputs for the user to choose from.The logic system on chips contain 270000 logic cells.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel
10AS027E2F29E2LG System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Package / Case	780-BBGA, FCBGA
Surface Mount	YES
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Series	Arria 10 SX
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	780
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	0.9V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B780
Number of Outputs	360
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	0.93V
Power Supplies	0.9V
Supply Voltage-Min (Vsup)	0.87V
Number of I/O	360
Speed	1.5GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Number of Inputs	360
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 270K Logic Elements
Number of Logic Cells	270000
Length	29mm
Height Seated (Max)	3.35mm
Width	29mm
RoHS Status	RoHS Compliant