This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 780-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Arria 10 SX is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines FPGA - 480K Logic Elements, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.360 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.9V.The SoCs wireless cannot operate at a voltage greater than 0.93V because it is considered unsafe for the application.If it has at least a 0.87V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 780 terminations, so system on a chip is really aided by this.There is the option to have 360 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 0.9V.Inputs are available on the SoC chip in the number of 360.There are 480000 logic cells in the logic system on chips.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel
10AS048E4F29E3LG System On Chip (SoC) applications.

POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness

Factory Lead Time	8 Weeks
Package / Case	780-BBGA, FCBGA
Surface Mount	YES
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Series	Arria 10 SX
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	780
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	0.9V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B780
Number of Outputs	360
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	0.93V
Power Supplies	0.9V
Supply Voltage-Min (Vsup)	0.87V
Number of I/O	360
Speed	1.5GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Number of Inputs	360
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 480K Logic Elements
Number of Logic Cells	480000
Length	29mm
Height Seated (Max)	3.35mm
Width	29mm
RoHS Status	RoHS Compliant