This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 896-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Arria V SX is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 462K Logic Elements.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 208, FPGA - 250 inputs and outputs.Ideally, a power supply with a voltage of 1.1V should be used.An excessive voltage of 1.13V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.07V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 896 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for 5ASXMB5.There is 622MHz clock frequency that is used in this SoC.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
64KB RAM.
Built on MCU, FPGA.
Clock Frequency: 622MHz

There are a lot of Intel
5ASXMB5E4F31I5N System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

Factory Lead Time	8 Weeks
Package / Case	896-BBGA, FCBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Arria V SX
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	896
Terminal Finish	TIN SILVER COPPER
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.1V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	5ASXMB5
JESD-30 Code	S-PBGA-B896
Supply Voltage-Max (Vsup)	1.13V
Supply Voltage-Min (Vsup)	1.07V
Number of I/O	MCU - 208, FPGA - 250
Speed	800MHz
RAM Size	64KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Clock Frequency	622MHz
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 462K Logic Elements
Length	31mm
Height Seated (Max)	2.7mm
Width	31mm
RoHS Status	RoHS Compliant