This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 672-FBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Automotive, AEC-Q100, Cyclone® V SE series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.A key point to note is that this SoC security combines FPGA - 85K Logic Elements.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 181, FPGA - 145.A 1.1V power supply should be used.There are voltages higher than 1.13V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.07V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 672 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 145 outputs.You will need to provide 1.11.2/3.32.5V power supplies in order to run system on chip.A SoC chip with 145 inputs is available to the user.85000 logic cells are included in logic system on chips.Searching 5CSEMA5 will yield system on chips with similar specs and purposes.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel 5CSEMA5U23A7N System On Chip (SoC) applications.
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
| Factory Lead Time | 8 Weeks |
| Package / Case | 672-FBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | Automotive, AEC-Q100, Cyclone® V SE |
| Published | 2018 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 672 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.1V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | 5CSEMA5 |
| JESD-30 Code | S-PBGA-B672 |
| Number of Outputs | 145 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.13V |
| Power Supplies | 1.11.2/3.32.5V |
| Supply Voltage-Min (Vsup) | 1.07V |
| Number of I/O | MCU - 181, FPGA - 145 |
| Speed | 700MHz |
| RAM Size | 64KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Number of Inputs | 145 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 85K Logic Elements |
| Number of Logic Cells | 85000 |
| Length | 23mm |
| Height Seated (Max) | 1.85mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |