66AK2G12ABY60 Overview
An electronic component available in package 625-LFBGA, FCBGA.Tray packaging is provided for it.Its DSP+ARM® status makes it ideal for a wide range of applications.It is mounted in the direction of Surface Mount as shown in the image below.If it is operating at the temperature of 0°C~90°C TJ, then it will be operating normally.This refers to the analog voltage range that can be input or output from 1.8V 3.3V.There are several digital signal processors in the 66AK2G1x KeyStone II Multicore series, including this one.The base part number 66AK2G12 can be used to identify many associated parts.
66AK2G12ABY60 Features
Supplied in the 625-LFBGA, FCBGA package

66AK2G12ABY60 Applications
There are a lot of Texas Instruments
66AK2G12ABY60 DSP applications.

Financial signals
Other sensor array processing
Spectral density estimation
Statistical signal processing
Digital image processing, data compression
Video coding, audio coding
Image compression
Signal processing for telecommunications
Control systems
Biomedical engineering

Factory Lead Time	26 Weeks
Mounting Type	Surface Mount
Package / Case	625-LFBGA, FCBGA
Operating Temperature	0°C~90°C TJ
Packaging	Tray
Series	66AK2G1x KeyStone II Multicore
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Type	DSP+ARM®
Base Part Number	66AK2G12
Interface	CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
Voltage - I/O	1.8V 3.3V
Non-Volatile Memory	External
Voltage - Core	0.9V
On Chip Data RAM	1MB
Clock Rate	600MHz
RoHS Status	ROHS3 Compliant