| Factory Lead Time | 16 Weeks |
| Package / Case | 484-BGA |
| Number of Pins | 484 |
| Supplier Device Package | 484-FPBGA (23x23) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | SmartFusion® |
| Published | 2000 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Frequency | 100MHz |
| Base Part Number | A2F500M3G |
| Operating Supply Voltage | 1.5V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Memory Size | 13.5kB |
| Operating Supply Current | 16.5mA |
| Number of I/O | MCU - 41, FPGA - 128 |
| Speed | 80MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Data Rate | 400 kbps |
| Architecture | MCU, FPGA |
| Number of Logic Elements/Cells | 5500 |
| Core Architecture | ARM |
| Number of Gates | 500000 |
| Max Frequency | 100MHz |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Flash Size | 512KB |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
A2F500M3G-FGG484 Datasheet
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