| Factory Lead Time | 12 Weeks |
| Package / Case | 624-FBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | i.MX6D |
| Published | 2002 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| ECCN Code | 5A992 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.35V |
| Speed | 1.0GHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
| Core Processor | ARM® Cortex®-A9 |
| Address Bus Width | 16 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| External Data Bus Width | 64 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| Length | 21mm |
| Height Seated (Max) | 2.16mm |
| RoHS Status | ROHS3 Compliant |
MCIMX6D6AVT10AD Datasheet
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