This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion® is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 26, FPGA - 66 I/Os are available in this SoC part.The flash size of the SoC meaning is 128KB.A search for A2F060M3E will result in system on chips that have similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 256-pin form.Just 0°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1FG256 System On Chip (SoC) applications.

POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness

Package / Case	256-LBGA
Number of Pins	256
Supplier Device Package	256-FPBGA (17x17)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®
Published	2009
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	85°C
Min Operating Temperature	0°C
Frequency	100MHz
Base Part Number	A2F060M3E
Operating Supply Voltage	1.5V
Interface	EBI/EMI, I2C, SPI, UART, USART
Number of I/O	MCU - 26, FPGA - 66
Speed	100MHz
RAM Size	16KB
Core Processor	ARM® Cortex®-M3
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I2C, SPI, UART/USART
Architecture	MCU, FPGA
Core Architecture	ARM
Max Frequency	100MHz
Number of Logic Blocks (LABs)	8
Speed Grade	1
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers	1536
Flash Size	128KB
Radiation Hardening	No
RoHS Status	Non-RoHS Compliant