This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 288-TFBGA, CSPBGA.A 16KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion® series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 28, FPGA - 68.A 1.5V power supply should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 288 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 68 outputs.A SoC chip with 68 inputs is available to the user.There is a flash of 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-CS288I System On Chip (SoC) applications.

Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports

Factory Lead Time	12 Weeks
Package / Case	288-TFBGA, CSPBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®
Published	2015
JESD-609 Code	e0
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	288
Terminal Finish	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	235
Supply Voltage	1.5V
Terminal Pitch	0.5mm
Frequency	80MHz
Time@Peak Reflow Temperature-Max (s)	20
Base Part Number	A2F060M3E
Number of Outputs	68
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.575V
Supply Voltage-Min (Vsup)	1.425V
Interface	EBI/EMI, I2C, SPI, UART, USART
Number of I/O	MCU - 28, FPGA - 68
RAM Size	16KB
Core Processor	ARM® Cortex®-M3
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I2C, SPI, UART/USART
Architecture	MCU, FPGA
Number of Inputs	68
Organization	1536 CLBS, 60000 GATES
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Core Architecture	ARM
Number of Logic Blocks (LABs)	8
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Equivalent Gates	60000
Flash Size	128KB
Length	11mm
Height Seated (Max)	1.05mm
Width	11mm
RoHS Status	Non-RoHS Compliant