This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package.With 16KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion® series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.Housed in the state-of-art Tray package.MCU - 26, FPGA - 66 I/Os in total are included in this SoC part.It is advised to utilize a 1.5V power supply.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 256 terminations in total and that really benefits system on a chip.It has a 128KB flash.You can get system on chips with similar specs and purposes by searching A2F060M3E.The wireless SoC works at a frequency of 80MHz.The SoC meaning is based on the core architecture of ARM.This is the 256-pin version of the computer SoC.It is rated with 1.575V maximum supply voltage.It is supplied with at least 1.425V power.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-FGG256 System On Chip (SoC) applications.

Automotive gateway
Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors

Factory Lead Time	2 Weeks
Mount	Surface Mount
Package / Case	256-LBGA
Number of Pins	256
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®
Published	2015
JESD-609 Code	e1
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	250
Supply Voltage	1.5V
Terminal Pitch	1mm
Frequency	80MHz
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	A2F060M3E
Operating Supply Voltage	1.5V
Interface	EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage	1.575V
Min Supply Voltage	1.425V
Memory Size	4.5kB
Operating Supply Current	3mA
Number of I/O	MCU - 26, FPGA - 66
RAM Size	16KB
Core Processor	ARM® Cortex®-M3
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, I2C, SPI, UART/USART
Data Rate	400 kbps
Architecture	MCU, FPGA
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	660
Core Architecture	ARM
Number of Gates	60000
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size	128KB
Length	17mm
Height Seated (Max)	1.7mm
Width	17mm
RoHS Status	RoHS Compliant