This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 208-BFQFP.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion® is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 22, FPGA - 66 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.The SoCs wireless cannot operate at a voltage greater than 1.575V because it is considered unsafe for the application.If it has at least a 1.425V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 208 terminations, so system on a chip is really aided by this.There is the option to have 66 outputs on this SoC chip.The flash size of the SoC meaning is 256KB.A search for A2F200 will result in system on chips that have similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 208-pin form.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-PQ208I System On Chip (SoC) applications.

POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness

Factory Lead Time	12 Weeks
Package / Case	208-BFQFP
Surface Mount	YES
Number of Pins	208
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®
Published	2015
JESD-609 Code	e0
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	208
Terminal Finish	Tin/Lead (Sn/Pb)
Terminal Position	QUAD
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	225
Supply Voltage	1.5V
Terminal Pitch	0.5mm
Frequency	80MHz
Time@Peak Reflow Temperature-Max (s)	20
Base Part Number	A2F200
Number of Outputs	66
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.575V
Supply Voltage-Min (Vsup)	1.425V
Interface	EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O	MCU - 22, FPGA - 66
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture	MCU, FPGA
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Core Architecture	ARM
Number of Logic Blocks (LABs)	8
Primary Attributes	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Equivalent Gates	200000
Flash Size	256KB
Height Seated (Max)	4.1mm
RoHS Status	Non-RoHS Compliant