This SoC is built on ARM® Cortex®-M3 core processor(s).A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 208-BFQFP.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion® series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 22, FPGA - 66.A 1.5V power supply should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 208 terminations in total makes system on a chip possible.There is a flash of 512KB.Searching A2F500M3G will yield system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Currently, the computer SoC is available in a 208-pin version.
ARM® Cortex®-M3 processor.64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation A2F500M3G-PQG208 System On Chip (SoC) applications.
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
| Factory Lead Time | 16 Weeks |
| Package / Case | 208-BFQFP |
| Surface Mount | YES |
| Number of Pins | 208 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | SmartFusion® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 208 |
| Terminal Finish | Pure Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 0.5mm |
| Frequency | 80MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F500M3G |
| Supply Voltage-Max (Vsup) | 1.575V |
| Supply Voltage-Min (Vsup) | 1.425V |
| Interface | Ethernet, I2C, SPI, UART, USART |
| Number of I/O | MCU - 22, FPGA - 66 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Organization | 11520 CLBS, 500000 GATES |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Logic Blocks (LABs) | 24 |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Number of Equivalent Gates | 500000 |
| Flash Size | 512KB |
| Length | 28mm |
| Height Seated (Max) | 4.1mm |
| Width | 28mm |
| RoHS Status | RoHS Compliant |