A2F500M3G-PQG208,Microsemi Corporation A2F500M3G-PQG208 supplier,Microsemi Corporation A2F500M3G-PQG208 priceIntegrated Circuits (ICs)
A2F500M3G-PQG208,Microsemi Corporation A2F500M3G-PQG208 supplier,Microsemi Corporation A2F500M3G-PQG208 priceIntegrated Circuits (ICs)
A2F500M3G-PQG208
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A2F500M3G-PQG208
    Part Number:KY-A2F500M3G-PQG208
    Mfr. Part No:A2F500M3G-PQG208
    Mfr.:Microsemi Corporation
    Stock:4644
    Description: 208 Terminations 0°C~85°C TJ 208 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 22, FPGA - 66 I/O 1.5V
    Data Sheet:A2F500M3G-PQG208 Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 208-BFQFP.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion® series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 22, FPGA - 66.A 1.5V power supply should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 208 terminations in total makes system on a chip possible.There is a flash of 512KB.Searching A2F500M3G will yield system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Currently, the computer SoC is available in a 208-pin version.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    512KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    A2F500M3G-PQG208 System On Chip (SoC) applications.

    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Factory Lead Time16 Weeks
    Package / Case208-BFQFP
    Surface MountYES
    Number of Pins208
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSmartFusion®
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations208
    Terminal FinishPure Matte Tin (Sn)
    HTS Code8542.39.00.01
    Terminal PositionQUAD
    Terminal FormGULL WING
    Peak Reflow Temperature (Cel)245
    Supply Voltage1.5V
    Terminal Pitch0.5mm
    Frequency80MHz
    Time@Peak Reflow Temperature-Max (s)30
    Base Part NumberA2F500M3G
    Supply Voltage-Max (Vsup)1.575V
    Supply Voltage-Min (Vsup)1.425V
    InterfaceEthernet, I2C, SPI, UART, USART
    Number of I/OMCU - 22, FPGA - 66
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDMA, POR, WDT
    ConnectivityEthernet, I2C, SPI, UART/USART
    ArchitectureMCU, FPGA
    Organization11520 CLBS, 500000 GATES
    Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
    Core ArchitectureARM
    Number of Logic Blocks (LABs)24
    Primary AttributesProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    Number of Equivalent Gates500000
    Flash Size512KB
    Length28mm
    Height Seated (Max)4.1mm
    Width28mm
    RoHS StatusRoHS Compliant
    
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