BCM5704CKFBG Overview
In order to save space on the board, 300-BGA packages are used.Telecommunications equipment is mounted with type Surface Mount.A 2-circuit composes this telecom IC .Mounted in the direction of Surface Mount.A 300 pin is included in this telecom interface.
BCM5704CKFBG Features
Available in the 300-BGA package

BCM5704CKFBG Applications
There are a lot of Broadcom Limited
BCM5704CKFBG Telecom applications.

T1/E1/J1 add/drop multiplexers (MUX)
Channel Service Units (CSUs): T1/E1/J1
Fractional T1/E1/J1
BITS Timing
Digital Access Cross-connect System (DACs)
Digital Cross-connect Systems (DCS)
Frame Relay Switches and Access Devices (FRADS)
ISDN Primary Rate Interfaces (PRA)
PBXs channel bank
PCM channel bank

Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	300-BGA
Number of Pins	300
Supplier Device Package	300-HBGA
Published	2012
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Function	Ethernet
Interface	PCI
Number of Circuits	2
RoHS Status	RoHS Compliant