EPM1270F256C5,Intel EPM1270F256C5 price,Integrated Circuits (ICs) EPM1270F256C5 Distributor,EPM1270F256C5 supplier
EPM1270F256C5,Intel EPM1270F256C5 price,Integrated Circuits (ICs) EPM1270F256C5 Distributor,EPM1270F256C5 supplier
EPM1270F256C5
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EPM1270F256C5
    Part Number:KY-EPM1270F256C5
    Mfr. Part No:EPM1270F256C5
    Mfr.:Intel
    Stock:8280
    Description: 1.5/3.32.5/3.3V 1mm PMIC MAX® II Series EPM1270 2.5V 256-BGA
    Data Sheet:EPM1270F256C5 Datasheet
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  • EPM1270F256C5 Overview
    A mobile phone network consists of 980macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).256-BGA is the package in which it resides.There are 212 I/Os programmed in it.The device is programmed with 256 terminations.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers and freight.Power is provided by a supply voltage of 2.5V volts.As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to 0°C~85°C TJ.The chip should be mounted by Surface Mount.It belongs to the MAX® IIseries of FPGAs.When using this device, IT CAN ALSO OPERATE AT 3.3V can also be found.The EPM1270 indicates that its related parts can be found.There are 1270 logic elements/blocks.The system runs on a power supply of 1.5/3.32.5/3.3V watts.In this case, the maximum supply voltage (Vsup) reaches 2.625V.It is recommended that the supply voltage (Vsup) be greater than 2.375V.
    EPM1270F256C5 Features
    256-BGA package
    212 I/Os
    The operating temperature of 0°C~85°C TJ
    1.5/3.32.5/3.3V power supplies

    EPM1270F256C5 Applications
    There are a lot of Intel
    EPM1270F256C5 CPLDs applications.

    Voltage level translation
    Timing control
    Interface bridging
    I/O expansion
    Discrete logic functions
    Bootloaders for FPGAs
    Address decoders
    Custom state machines
    Digital systems
    Portable digital devices
    Factory Lead Time8 Weeks
    Mounting TypeSurface Mount
    Package / Case256-BGA
    Surface MountYES
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesMAX® II
    JESD-609 Codee0
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations256
    ECCN Code3A991
    Terminal FinishTIN LEAD
    Additional FeatureIT CAN ALSO OPERATE AT 3.3V
    HTS Code8542.39.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)220
    Supply Voltage2.5V
    Terminal Pitch1mm
    Time@Peak Reflow Temperature-Max (s)30
    Base Part NumberEPM1270
    JESD-30 CodeS-PBGA-B256
    Qualification StatusNot Qualified
    Supply Voltage-Max (Vsup)2.625V
    Power Supplies1.5/3.32.5/3.3V
    Supply Voltage-Min (Vsup)2.375V
    Programmable TypeIn System Programmable
    Number of I/O212
    Propagation Delay10 ns
    Output FunctionMACROCELL
    Number of Macro Cells980
    JTAG BSTYES
    Voltage Supply - Internal2.5V 3.3V
    Delay Time tpd(1) Max6.2ns
    Number of Logic Elements/Blocks1270
    Length17mm
    Height Seated (Max)2.2mm
    Width17mm
    RoHS StatusNon-RoHS Compliant
    
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