EPM570F256C3,Intel EPM570F256C3 price,Integrated Circuits (ICs) EPM570F256C3 Distributor,EPM570F256C3 supplier
EPM570F256C3,Intel EPM570F256C3 price,Integrated Circuits (ICs) EPM570F256C3 Distributor,EPM570F256C3 supplier
EPM570F256C3
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EPM570F256C3
    Part Number:KY-EPM570F256C3
    Mfr. Part No:EPM570F256C3
    Mfr.:Intel
    Stock:4730
    Description: 1.5/3.32.5/3.3V 1mm PMIC MAX® II Series EPM570 2.5V 256-BGA
    Data Sheet:EPM570F256C3 Datasheet
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  • EPM570F256C3 Overview
    There are 440 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.It is part of the 256-BGA package.The device has 160 inputs and outputs.There are 256 terminations programmed into the device.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers or freight.Power is supplied by a voltage of 2.5V volts.The chip should be packaged by Tray.The temperature at which it operates is set to 0°C~85°C TJ in order to ensure its reliability.Surface Mount should be used for mounting the chip.The MAX® II series comprises this type of FPGA.The device can also be used to find IT CAN ALSO OPERATE AT 3.3V.The EPM570 indicates that related parts can be found.There are 570 logic elements or blocks present.In order for the device to operate, it requires 1.5/3.32.5/3.3V power supplies.Vsup reaches 2.625V as the maximum supply voltage.A supply voltage (Vsup) of greater than 2.375V should be used.
    EPM570F256C3 Features
    256-BGA package
    160 I/Os
    The operating temperature of 0°C~85°C TJ
    1.5/3.32.5/3.3V power supplies

    EPM570F256C3 Applications
    There are a lot of Intel
    EPM570F256C3 CPLDs applications.

    Interface bridging
    I/O expansion
    Discrete logic functions
    Bootloaders for FPGAs
    Address decoders
    Custom state machines
    Digital systems
    Portable digital devices
    Handheld digital devices
    Battery operated portable devices
    Factory Lead Time8 Weeks
    Mounting TypeSurface Mount
    Package / Case256-BGA
    Surface MountYES
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesMAX® II
    JESD-609 Codee0
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations256
    ECCN CodeEAR99
    Terminal FinishTin/Lead (Sn/Pb)
    Additional FeatureIT CAN ALSO OPERATE AT 3.3V
    HTS Code8542.39.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)220
    Supply Voltage2.5V
    Terminal Pitch1mm
    Time@Peak Reflow Temperature-Max (s)30
    Base Part NumberEPM570
    JESD-30 CodeS-PBGA-B256
    Qualification StatusNot Qualified
    Supply Voltage-Max (Vsup)2.625V
    Power Supplies1.5/3.32.5/3.3V
    Supply Voltage-Min (Vsup)2.375V
    Programmable TypeIn System Programmable
    Number of I/O160
    Propagation Delay5.4 ns
    Output FunctionMACROCELL
    Number of Macro Cells440
    JTAG BSTYES
    Voltage Supply - Internal2.5V 3.3V
    Delay Time tpd(1) Max5.4ns
    Number of Logic Elements/Blocks570
    Length17mm
    Height Seated (Max)2.2mm
    Width17mm
    RoHS StatusNon-RoHS Compliant
    
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