EPM9400RC240-20 Overview
A mobile phone network consists of 400macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).240-BFQFP Exposed Pad is the package in which it resides.There are 159 I/Os programmed in it.As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to 0°C~70°C TA.The chip should be mounted by Surface Mount.It belongs to the MAX® 9000series of FPGAs.The EPM9400 indicates that its related parts can be found.8000 gates are devices that serve as building blocks for digital circuits.There are 25 logic elements/blocks.
EPM9400RC240-20 Features
240-BFQFP Exposed Pad package
159 I/Os
The operating temperature of 0°C~70°C TA

EPM9400RC240-20 Applications
There are a lot of Intel
EPM9400RC240-20 CPLDs applications.

Voltage level translation
Timing control
Interface bridging
I/O expansion
Discrete logic functions
Bootloaders for FPGAs
Address decoders
Custom state machines
Digital systems
Portable digital devices

Mounting Type	Surface Mount
Package / Case	240-BFQFP Exposed Pad
Supplier Device Package	240-RQFP (32x32)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	MAX® 9000
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Base Part Number	EPM9400
Programmable Type	In System Programmable
Number of I/O	159
Number of Gates	8000
Number of Macro Cells	400
Voltage Supply - Internal	4.75V~5.25V
Delay Time tpd(1) Max	20ns
Number of Logic Elements/Blocks	25