IDT74SSTUBH32865ABKG Overview
The package BGA includes it.For the device to function normally, voltage 1.8V is supplied.To store information, the memory has a size of 28 bits.A total of 160 pins are present on the component.Through 160 terminations, signals are prevented from reflecting off the end of transmission lines.Using Surface Mount, it is mounted.As part of its construction, it has 160 pins.As a key factor in its operation, the voltage supply to 1.9V plays an important role.SSTU electronic parts are optimized for high quality and reliability.There is no doubt that the maximum value of 70°C should not be exceeded by its operating temperature.The operating temperature should not be lower than 0°C at all times.It uses a logic IC type of D FLIP-FLOP.
IDT74SSTUBH32865ABKG Features

IDT74SSTUBH32865ABKG Applications
There are a lot of Integrated Device Technology (IDT)
IDT74SSTUBH32865ABKG Specialty Logic ICs applications.

Wireless modems
Remote controls
Wireless network systems
Satellite communications networks
Ethernet circuitry
Wired telephone
Cordless telephone
Desktop PC
Notebook
Pocket PC

Mount	Surface Mount
Package / Case	BGA
Number of Pins	160
Published	2006
JESD-609 Code	e1
Number of Terminations	160
Terminal Finish	TIN SILVER COPPER
Max Operating Temperature	70°C
Min Operating Temperature	0°C
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	1.8V
Terminal Pitch	0.65mm
Time@Peak Reflow Temperature-Max (s)	40
Pin Count	160
Qualification Status	Not Qualified
Operating Supply Voltage	1.9V
Temperature Grade	COMMERCIAL
Supply Voltage-Min (Vsup)	1.7V
Number of Bits	28
Family	SSTU
Logic Function	Buffer
Output Polarity	TRUE
Logic IC Type	D FLIP-FLOP
Trigger Type	POSITIVE EDGE
Propagation Delay (tpd)	1.6 ns
fmax-Min	410 MHz
Length	13mm
Height Seated (Max)	1.3mm
Width	9mm
RoHS Status	RoHS Compliant