LFXP3C-3QN208C Overview
Fpga chips is supplied in the 208-BFQFP package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 136 I/Os for transferring data in a more coherent manner. There are 3000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~3.465V. It is a type of FPGA belonging to the XP seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 136 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 208 terminations. The RAM bits that this device offer is 55296. Its base part number LFXP3 can be used to find related parts. The RAM si6.8kBe of this FPGA module reaches 6.8kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 208 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.8/2.5/3.3V power supply. Fpga semiconductor is equipped wfpga semiconductorh 208 pin count. This FPGA module embeds a memory of 8.3kB available for storing programs and data. 384 CLBs are basic modules used for its architecture. Fpga semiconductor operates at a frequency of 320MHz to deliver high efficiency. Fpga semiconductor incorporates 384 logic cells used for the building block.
LFXP3C-3QN208C Features
136 I/Os
Up to 55296 RAM bits
208 LABs/CLBs
Operating from a frequency of 320MHz

LFXP3C-3QN208C Applications
There are a lot of Lattice Semiconductor Corporation
LFXP3C-3QN208C FPGAs applications.

Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition

Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	208-BFQFP
Number of Pins	208
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	XP
Published	2000
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	208
ECCN Code	EAR99
Terminal Finish	Matte Tin (Sn)
HTS Code	8542.39.00.01
Voltage - Supply	1.71V~3.465V
Terminal Position	QUAD
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	245
Supply Voltage	1.8V
Terminal Pitch	0.5mm
Frequency	320MHz
Time@Peak Reflow Temperature-Max (s)	40
Base Part Number	LFXP3
Pin Count	208
Number of Outputs	136
Operating Supply Voltage	1.8V
Power Supplies	1.8/2.5/3.3V
Memory Size	8.3kB
Number of I/O	136
RAM Size	6.8kB
Organization	384 CLBS
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	3000
Total RAM Bits	55296
Combinatorial Delay of a CLB-Max	0.63 ns
Number of CLBs	384
Number of Logic Cells	384
Length	28mm
Height Seated (Max)	4.1mm
Width	28mm
Radiation Hardening	No
RoHS Status	RoHS Compliant
Lead Free	Lead Free