LS1022AXN7EKB Overview
Packed in 525-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around -40°C~105°C. It comes from the QorIQ® Layerscape series. This CPU is cored with a ARM® Cortex®-A7 processor. This CPU uses DDR3L, DDR4 RAM controllers.
LS1022AXN7EKB Features
ARM® Cortex®-A7 Core

LS1022AXN7EKB Applications
There are a lot of NXP USA Inc.
LS1022AXN7EKB Microprocessor applications.

Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan

Factory Lead Time	18 Weeks
Package / Case	525-FBGA, FCBGA
Operating Temperature	-40°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	600MHz
Core Processor	ARM® Cortex®-A7
Ethernet	GbE (2)
Number of Cores/Bus Width	2 Core 32-Bit
RAM Controllers	DDR3L, DDR4
USB	USB 2.0 (1)
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	Secure Boot, TrustZone®
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant