LS1023ASE7KQB Overview
The embedded microprocessor has been packed in 621-FBGA, FCBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 2 Core 64-Bit cores and width 2 Core 64-Bit busses is used. Understand how the operating temperature around 0°C~105°C is determined. This is a member of the QorIQ® Layerscape series. With a core count of ARM® Cortex®-A53, this CPU is multicore. A CPU with this architecture uses DDR3L, DDR4 RAM controllers.
LS1023ASE7KQB Features
ARM® Cortex®-A53 Core

LS1023ASE7KQB Applications
There are a lot of NXP USA Inc.
LS1023ASE7KQB Microprocessor applications.

Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products

Factory Lead Time	18 Weeks
Package / Case	621-FBGA, FCBGA
Operating Temperature	0°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2014
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.0GHz
Core Processor	ARM® Cortex®-A53
Ethernet	1GbE (7) or 10GbE (1) & 1GbE (5)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR3L, DDR4
USB	USB 3.0 (2) + PHY
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
RoHS Status	ROHS3 Compliant