LS1023ASN8MNLB Overview
With a packing size of 780-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 2 Core 64-Bit cores/bus width. Be aware of the operating temperature around 0°C~105°C. A QorIQ® Layerscape series item. A ARM® Cortex®-A53 processor is present in this CPU. The CPU contains DDR3L, DDR4 RAM controllers.
LS1023ASN8MNLB Features
ARM® Cortex®-A53 Core

LS1023ASN8MNLB Applications
There are a lot of NXP USA Inc.
LS1023ASN8MNLB Microprocessor applications.

Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Operating Temperature	0°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2014
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.2GHz
Core Processor	ARM® Cortex®-A53
Ethernet	1GbE (7) or 10GbE (1) & 1GbE (5)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR3L, DDR4
USB	USB 3.0 (2) + PHY
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
RoHS Status	ROHS3 Compliant