LS1026AXE8Q1A Overview
The microprocessor is conveniently packaged in 780-FBGA, FCBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 2 Core 64-Bit cores/bus width on the CPU. Understand the operating temperature around -40°C~105°C. The QorIQ® Layerscape series contains it. A ARM® Cortex®-A72 processor powers this CPU. DDR4 RAM controllers are used by this CPU.
LS1026AXE8Q1A Features
ARM® Cortex®-A72 Core

LS1026AXE8Q1A Applications
There are a lot of NXP USA Inc.
LS1026AXE8Q1A Microprocessor applications.

Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator

Factory Lead Time	18 Weeks
Package / Case	780-FBGA, FCBGA
Operating Temperature	-40°C~105°C
Packaging	Tray
Series	QorIQ® Layerscape
Published	2016
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	1.6GHz
Core Processor	ARM® Cortex®-A72
Ethernet	10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width	2 Core 64-Bit
RAM Controllers	DDR4
USB	USB 3.0 (3) + PHY
Security Features	Secure Boot, TrustZone®
SATA	SATA 6Gbps (1)
RoHS Status	ROHS3 Compliant