LS102MASN7EHA Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 448-FBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. 2 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the QorlQ LS1 series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR2 RAM controllers are used by this CPU. The microprocessor features interfaces I2C, PCIe, PCM/TDM, SPI, UART for better service. It is offered by suppliers as a package 448-PBGA w/Heat Spreader (23x23).
LS102MASN7EHA Features
ARM1136JF-S Core

LS102MASN7EHA Applications
There are a lot of NXP USA Inc.
LS102MASN7EHA Microprocessor applications.

Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio

Factory Lead Time	12 Weeks
Package / Case	448-FBGA Exposed Pad
Supplier Device Package	448-PBGA w/Heat Spreader (23x23)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	QorlQ LS1
Published	2014
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	650MHz
Core Processor	ARM1136JF-S
Ethernet	GbE (2)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DDR2
USB	USB 2.0 + PHY (1)
Additional Interfaces	I2C, PCIe, PCM/TDM, SPI, UART
RoHS Status	ROHS3 Compliant