M2S010-1FGG484I,Microsemi Corporation M2S010-1FGG484I price,Integrated Circuits (ICs) M2S010-1FGG484I Distributor,M2S010-1FGG484I supplier
M2S010-1FGG484I,Microsemi Corporation M2S010-1FGG484I price,Integrated Circuits (ICs) M2S010-1FGG484I Distributor,M2S010-1FGG484I supplier
M2S010-1FGG484I
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M2S010-1FGG484I
    Part Number:KY-M2S010-1FGG484I
    Mfr. Part No:M2S010-1FGG484I
    Mfr.:Microsemi Corporation
    Stock:6996
    Description: -40°C~100°C TJ M2S010 System On Chip SmartFusion®2 Series 233 I/O
    Data Sheet:M2S010-1FGG484I Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 233 I/Os.A flashing 256KB appears on it.Searching M2S010 will bring up system on chips with similar specs and purposes.At 166MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The SoC computing will start only if -40°C is set.This SoC system on chip is designed to operate at a temperature of 100°C.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    M2S010-1FGG484I System On Chip (SoC) applications.

    Industrial robot
    High-end PLC
    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
    Factory Lead Time8 Weeks
    Package / Case484-BGA
    Supplier Device Package484-FPBGA (23x23)
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Published2009
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature100°C
    Min Operating Temperature-40°C
    Frequency166MHz
    Base Part NumberM2S010
    InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
    Number of I/O233
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Core ArchitectureARM
    Primary AttributesFPGA - 10K Logic Modules
    Flash Size256KB
    RoHS StatusRoHS Compliant
    
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