M2S010T-1VFG400I,Microsemi Corporation M2S010T-1VFG400I price,Integrated Circuits (ICs) M2S010T-1VFG400I Distributor,M2S010T-1VFG400I supplier
M2S010T-1VFG400I,Microsemi Corporation M2S010T-1VFG400I price,Integrated Circuits (ICs) M2S010T-1VFG400I Distributor,M2S010T-1VFG400I supplier
M2S010T-1VFG400I
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M2S010T-1VFG400I
    Part Number:KY-M2S010T-1VFG400I
    Mfr. Part No:M2S010T-1VFG400I
    Mfr.:Microsemi Corporation
    Stock:3548
    Description: -40°C~100°C TJ 400 Pin M2S010T System On Chip SmartFusion®2 Series 195 I/O
    Data Sheet:M2S010T-1VFG400I Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 400-LFBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 10K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.195 I/Os are available in this SoC part.The flash size of the SoC meaning is 256KB.A search for M2S010T will result in system on chips that have similar specs and purposes.A frequency of 166MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 400-pin form.Just -40°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    M2S010T-1VFG400I System On Chip (SoC) applications.

    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
    Factory Lead Time10 Weeks
    Package / Case400-LFBGA
    Number of Pins400
    Supplier Device Package400-VFBGA (17x17)
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Published2009
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature100°C
    Min Operating Temperature-40°C
    Frequency166MHz
    Base Part NumberM2S010T
    InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
    Number of I/O195
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Core ArchitectureARM
    Primary AttributesFPGA - 10K Logic Modules
    Flash Size256KB
    RoHS StatusRoHS Compliant
    
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