M2S010TS-1FG484I,Microsemi Corporation M2S010TS-1FG484I supplier,Microsemi Corporation M2S010TS-1FG484I priceIntegrated Circuits (ICs)
M2S010TS-1FG484I,Microsemi Corporation M2S010TS-1FG484I supplier,Microsemi Corporation M2S010TS-1FG484I priceIntegrated Circuits (ICs)
M2S010TS-1FG484I
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M2S010TS-1FG484I
    Part Number:KY-M2S010TS-1FG484I
    Mfr. Part No:M2S010TS-1FG484I
    Mfr.:Microsemi Corporation
    Stock:6108
    Description: -40°C~100°C TJ M2S010TS System On Chip SmartFusion®2 Series 233 I/O
    Data Sheet:M2S010TS-1FG484I Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 484-BGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 233.There is a flash of 256KB.Searching M2S010TS will yield system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.In order for the SoC computing to start up, -40°C is sufficient.There is a design maximum operating temperature of 100°C for this SoC system on chip.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    M2S010TS-1FG484I System On Chip (SoC) applications.

    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
    Factory Lead Time10 Weeks
    Package / Case484-BGA
    Supplier Device Package484-FPBGA (23x23)
    Operating Temperature-40°C~100°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature100°C
    Min Operating Temperature-40°C
    Frequency166MHz
    Base Part NumberM2S010TS
    InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
    Number of I/O233
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Core ArchitectureARM
    Primary AttributesFPGA - 10K Logic Modules
    Flash Size256KB
    RoHS StatusNon-RoHS Compliant
    
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