M2S025-1VF256,Microsemi Corporation M2S025-1VF256 supplier,Microsemi Corporation M2S025-1VF256 priceIntegrated Circuits (ICs)
M2S025-1VF256,Microsemi Corporation M2S025-1VF256 supplier,Microsemi Corporation M2S025-1VF256 priceIntegrated Circuits (ICs)
M2S025-1VF256
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M2S025-1VF256
    Part Number:KY-M2S025-1VF256
    Mfr. Part No:M2S025-1VF256
    Mfr.:Microsemi Corporation
    Stock:13878
    Description: 256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
    Data Sheet:M2S025-1VF256 Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LFBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.138 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which makes system on a chip possible.A SoC chip with 138 outputs is available.A power supply of 1.2V is required.A SoC chip with 138 inputs is available.A logic SoC has 27696 logic cells.A 256KB flash can be seen on it.Aside from that, this SoC processor features LG-MIN, WD-MIN.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    LG-MIN, WD-MIN

    There are a lot of Microsemi Corporation
    M2S025-1VF256 System On Chip (SoC) applications.

    Body control module
    Industrial transport
    Industrial robot
    High-end PLC
    Vending machines
    POS Terminals
    Measurement tools
    Measurement testers
    Networked sensors
    Robotics
    Factory Lead Time10 Weeks
    Package / Case256-LFBGA
    Surface MountYES
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Published2015
    JESD-609 Codee0
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations256
    Terminal FinishTin/Lead (Sn/Pb)
    Additional FeatureLG-MIN, WD-MIN
    HTS Code8542.39.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Supply Voltage1.2V
    Terminal Pitch0.8mm
    Reach Compliance Codenot_compliant
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    JESD-30 CodeS-PBGA-B256
    Number of Outputs138
    Qualification StatusNot Qualified
    Supply Voltage-Max (Vsup)1.26V
    Power Supplies1.2V
    Supply Voltage-Min (Vsup)1.14V
    Number of I/O138
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Number of Inputs138
    Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
    Primary AttributesFPGA - 25K Logic Modules
    Number of Logic Cells27696
    Flash Size256KB
    Length14mm
    Height Seated (Max)1.56mm
    Width14mm
    RoHS StatusNon-RoHS Compliant
    
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