M2S050T-1FG484,Microsemi Corporation M2S050T-1FG484 price,Integrated Circuits (ICs) M2S050T-1FG484 Distributor,M2S050T-1FG484 supplier
M2S050T-1FG484,Microsemi Corporation M2S050T-1FG484 price,Integrated Circuits (ICs) M2S050T-1FG484 Distributor,M2S050T-1FG484 supplier
M2S050T-1FG484
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M2S050T-1FG484
    Part Number:KY-M2S050T-1FG484
    Mfr. Part No:M2S050T-1FG484
    Mfr.:Microsemi Corporation
    Stock:3132
    Description: 0°C~85°C TJ M2S050T System On Chip SmartFusion®2 Series 267 I/O
    Data Sheet:M2S050T-1FG484 Datasheet
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  • This SoC is built on ARM® Cortex®-M3 core processor(s).
    Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 267 I/Os.As for its flash size, it is 256KB.By searching M2S050T, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.It just takes 0°C for the SoC computing to start up, and that is all it needs.There is a design maximum operating temperature 85°C specified for this SoC system on chip.
    ARM® Cortex®-M3 processor.
    64KB RAM.
    Built on MCU, FPGA.
    256KB extended flash.
    Core Architecture: ARM

    There are a lot of Microsemi Corporation
    M2S050T-1FG484 System On Chip (SoC) applications.

    Measurement testers
    Networked sensors
    Robotics
    Central alarm system
    Smart appliances
    Industrial automation devices
    Sports
    Fitness
    Healthcare
    Medical
    Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
    Factory Lead Time8 Weeks
    Package / Case484-BGA
    Supplier Device Package484-FPBGA (23x23)
    Operating Temperature0°C~85°C TJ
    PackagingTray
    SeriesSmartFusion®2
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Max Operating Temperature85°C
    Min Operating Temperature0°C
    Frequency166MHz
    Base Part NumberM2S050T
    InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
    Number of I/O267
    Speed166MHz
    RAM Size64KB
    Core ProcessorARM® Cortex®-M3
    PeripheralsDDR, PCIe, SERDES
    ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
    ArchitectureMCU, FPGA
    Core ArchitectureARM
    Primary AttributesFPGA - 50K Logic Modules
    Flash Size256KB
    RoHS StatusNon-RoHS Compliant
    
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