This SoC is built on ARM® Cortex®-M3 core processor(s).On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 50K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 267 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 484 terminations, which is great for system on a chip.There are 267 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 267 inputs available for use.Logic system on chips consist of 56340 logic cells.There is a flash of 256KB on it.
ARM® Cortex®-M3 processor.64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation M2S050TS-FG484 System On Chip (SoC) applications.
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Factory Lead Time | 10 Weeks |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| Published | 2015 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 267 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 267 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 267 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Length | 23mm |
| Height Seated (Max) | 2.44mm |
| Width | 23mm |
| RoHS Status | Non-RoHS Compliant |