This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 60K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 387 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 676 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 387 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 387 inputs for the user to choose from.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S060T-1FGG676 System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time	10 Weeks
Package / Case	676-BGA
Surface Mount	YES
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®2
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	676
Terminal Finish	MATTE TIN
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B676
Number of Outputs	387
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Number of I/O	387
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	387
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 60K Logic Modules
Number of Logic Cells	56520
Flash Size	256KB
Length	27mm
Height Seated (Max)	2.44mm
Width	27mm
RoHS Status	RoHS Compliant