This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 60K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 200 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 325 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 200 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 200 inputs for the user to choose from.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S060TS-1FCSG325I System On Chip (SoC) applications.

Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare

Lifecycle Status	IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time	10 Weeks
Package / Case	325-TFBGA, CSPBGA
Surface Mount	YES
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	SmartFusion®2
Published	2015
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	325
Terminal Finish	MATTE TIN
Additional Feature	LG-MIN, WD-MIN
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.2V
Terminal Pitch	0.5mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B325
Number of Outputs	200
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	1.26V
Power Supplies	1.2V
Supply Voltage-Min (Vsup)	1.14V
Number of I/O	200
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Number of Inputs	200
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 60K Logic Modules
Number of Logic Cells	56520
Flash Size	256KB
Length	11mm
Height Seated (Max)	1.01mm
Width	11mm
RoHS Status	RoHS Compliant