MC68EN360CVR25L Overview
The microprocessor is convenient for international shipping since it is packaged in 357-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~85°C TA should be understood. This is part of the M683xx series. The CPU is powered by a CPU32+ core. There are DRAM RAM controllers on this CPU. This microprocessor features SCC, SMC, SPI interfaces to better serve its users. The CPU runs I/O at 5.0V. uPs/uCs/Peripheral ICs are a RISC MICROCONTROLLER. Using MC68EN360 will help you find variants of the cpu microprocessor. To date, there have been 357 terminations.
MC68EN360CVR25L Features
CPU32+ Core

MC68EN360CVR25L Applications
There are a lot of NXP USA Inc.
MC68EN360CVR25L Microprocessor applications.

Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle

Factory Lead Time	8 Weeks
Package / Case	357-BBGA
Surface Mount	YES
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	M683xx
Published	1995
JESD-609 Code	e1
Part Status	Last Time Buy
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	357
ECCN Code	3A991.A.2
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Base Part Number	MC68EN360
JESD-30 Code	S-PBGA-B357
Speed	25MHz
uPs/uCs/Peripheral ICs Type	RISC MICROCONTROLLER
Core Processor	CPU32+
Voltage - I/O	5.0V
Ethernet	10Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	SCC, SMC, SPI
Co-Processors/DSP	Communications; CPM
RoHS Status	ROHS3 Compliant