MCIMX250DJM4AR2 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 400-LFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. The cpu microprocessor belongs to the i.MX25 series. The CPU is cored with a ARM926EJ-S processor.
MCIMX250DJM4AR2 Features
ARM926EJ-S Core

MCIMX250DJM4AR2 Applications
There are a lot of NXP USA Inc.
MCIMX250DJM4AR2 Microprocessor applications.

Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers

Factory Lead Time	15 Weeks
Package / Case	400-LFBGA
Packaging	Tray
Series	i.MX25
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	400MHz
Core Processor	ARM926EJ-S
Number of Cores/Bus Width	1 Core 32-Bit
RoHS Status	ROHS3 Compliant