MCIMX6D4AVT10AER OverviewWith a packing size of 624-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 2 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~125°C TJ. A i.MX6D series item. A ARM® Cortex®-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address.
MCIMX6D4AVT10AER FeaturesARM® Cortex®-A9 Core
MCIMX6D4AVT10AER ApplicationsThere are a lot of NXP USA Inc.
MCIMX6D4AVT10AER Microprocessor applications.
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
| Factory Lead Time | 14 Weeks |
| Package / Case | 624-FBGA, FCBGA |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tape & Reel (TR) |
| Series | i.MX6D |
| Published | 2002 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |