MCIMX6D5EYM10AE Overview
The microprocessor is convenient for international shipping since it is packaged in 624-LFBGA, FCBGA. The packaging method Tray provides high reliability. There are 2 Core 32-Bit cores per bus width on the CPU. The operating temperature around -20°C~105°C TJ should be understood. This is part of the i.MX6D series. The CPU is powered by a ARM® Cortex®-A9 core. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. This microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to better serve its users. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6D5EYM10AE Features
ARM® Cortex®-A9 Core

MCIMX6D5EYM10AE Applications
There are a lot of NXP USA Inc.
MCIMX6D5EYM10AE Microprocessor applications.

Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle

Factory Lead Time	15 Weeks
Package / Case	624-LFBGA, FCBGA
Operating Temperature	-20°C~105°C TJ
Packaging	Tray
Series	i.MX6D
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	1.0GHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (4)
Additional Interfaces	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant