MCIMX6D5EYM12AE OverviewPacked in 624-LFBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around -20°C~105°C TJ. It comes from the i.MX6D series. This CPU is cored with a ARM® Cortex®-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. This CPU runs I/O at 1.8V 2.5V 2.8V 3.3V. As far as the uPs/uCs/Peripheral ICs type is concerned, this is a MICROPROCESSOR. There are 624 terminations totally. The supply voltage should not exceed 1.5V. This CPU has a wide external data Bus width of 64.
MCIMX6D5EYM12AE FeaturesARM® Cortex®-A9 Core
MCIMX6D5EYM12AE ApplicationsThere are a lot of NXP USA Inc.
MCIMX6D5EYM12AE Microprocessor applications.
Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -20°C~105°C TJ |
| Packaging | Tray |
| Series | i.MX6D |
| Published | 2002 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| ECCN Code | 5A992 |
| HTS Code | 8542.31.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
| Supply Voltage-Min (Vsup) | 1.275V |
| Speed | 1.2GHz |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
| Core Processor | ARM® Cortex®-A9 |
| Address Bus Width | 16 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| External Data Bus Width | 64 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| Length | 21mm |
| Height Seated (Max) | 1.6mm |
| RoHS Status | ROHS3 Compliant |