MCIMX6D5EZK08AE OverviewSince the microprocessor is packed in 569-LFBGA, shipping overseas is convenient. High reliability is achieved by using advanced packaging methods Tray. This CPU has 2 Core 32-Bit cores and 2 Core 32-Bit bus widths. K-20°C~105°C TJw what the operating temperature is around -20°C~105°C TJ. In the series i.MX6D, it is found. ARM® Cortex®-A9 processors are embedded in this CPU. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6D5EZK08AE FeaturesARM® Cortex®-A9 Core
MCIMX6D5EZK08AE ApplicationsThere are a lot of NXP USA Inc.
MCIMX6D5EZK08AE Microprocessor applications.
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
Factory Lead Time | 15 Weeks |
Package / Case | 569-LFBGA |
Operating Temperature | -20°C~105°C TJ |
Packaging | Tray |
Series | i.MX6D |
Published | 2002 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
HTS Code | 8542.39.00.01 |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Speed | 800MHz |
Core Processor | ARM® Cortex®-A9 |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
SATA | SATA 3Gbps (1) |
RoHS Status | ROHS3 Compliant |