MCIMX6DP4AVT1AA,NXP USA Inc. MCIMX6DP4AVT1AA supplier,NXP USA Inc. MCIMX6DP4AVT1AA priceIntegrated Circuits (ICs)
MCIMX6DP4AVT1AA,NXP USA Inc. MCIMX6DP4AVT1AA supplier,NXP USA Inc. MCIMX6DP4AVT1AA priceIntegrated Circuits (ICs)
MCIMX6DP4AVT1AA
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MCIMX6DP4AVT1AA
    Part Number:KY-MCIMX6DP4AVT1AA
    Mfr. Part No:MCIMX6DP4AVT1AA
    Mfr.:NXP USA Inc.
    Stock:1532
    Description: 0.8mm ARM® Cortex®-A9 32-bit Microprocessor i.MX6DP Series 624-FBGA, FCBGA
    Data Sheet:MCIMX6DP4AVT1AA Datasheet
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  • MCIMX6DP4AVT1AA Overview
    Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 32-Bit. Recognize operating temperatures around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6DP series. The CPU is cored with a ARM® Cortex®-A9 processor. The CPU uses LPDDR2, DDR3L, DDR3 RAM controllers. This microprocessor features interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR, RISC. In total, there are 624 terminations. In terms of architecture, it is a 32-Bit system. It can supply a maximum current of 1.5V. 64 is the width of the external data bus on this CPU.
    MCIMX6DP4AVT1AA Features
    ARM® Cortex®-A9 Core
    32-Bit Structure

    MCIMX6DP4AVT1AA Applications
    There are a lot of NXP USA Inc.
    MCIMX6DP4AVT1AA Microprocessor applications.

    Consumer electronics products
    Toys
    Robots
    Radio
    Television
    Heater/Fan
    Calculator
    Kindle
    Christmas lights
    3D printers
    Factory Lead Time15 Weeks
    Package / Case624-FBGA, FCBGA
    Surface MountYES
    Operating Temperature-40°C~125°C TJ
    PackagingTray
    Seriesi.MX6DP
    Published2002
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Number of Terminations624
    ECCN Code5A992
    HTS Code8542.31.00.01
    Terminal PositionBOTTOM
    Terminal FormBALL
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Terminal Pitch0.8mm
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    JESD-30 CodeS-PBGA-B624
    Supply Voltage-Max (Vsup)1.5V
    Supply Voltage-Min (Vsup)1.35V
    Speed1.0GHz
    uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
    Core ProcessorARM® Cortex®-A9
    Bit Size32
    Address Bus Width26
    Boundary ScanYES
    Low Power ModeYES
    External Data Bus Width64
    FormatFLOATING POINT
    Integrated CacheYES
    Voltage - I/O1.8V 2.5V 2.8V 3.3V
    Ethernet10/100/1000Mbps (1)
    Number of Cores/Bus Width2 Core 32-Bit
    Graphics AccelerationYes
    RAM ControllersLPDDR2, DDR3L, DDR3
    USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
    Additional InterfacesCAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
    Co-Processors/DSPMultimedia; NEON™ SIMD
    Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
    Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
    SATASATA 3Gbps (1)
    Length21mm
    Height Seated (Max)2.16mm
    RoHS StatusROHS3 Compliant
    
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