MCIMX6DP6AVT8ABR Overview
Due to its 624-FBGA, FCBGA packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tape & Reel (TR). Cores/Bus width of the CPU is 2 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the i.MX6DP series. ARM® Cortex®-A9 is the processor core of this CPU. Memory controllers for this CPU are LPDDR2, DDR3L, DDR3. Featuring CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces, this microprocessor can better serve you. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU. Suppliers offer the package 624-FCBGA (21x21).
MCIMX6DP6AVT8ABR Features
ARM® Cortex®-A9 Core

MCIMX6DP6AVT8ABR Applications
There are a lot of NXP USA Inc.
MCIMX6DP6AVT8ABR Microprocessor applications.

Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens

Factory Lead Time	12 Weeks
Package / Case	624-FBGA, FCBGA
Supplier Device Package	624-FCBGA (21x21)
Operating Temperature	-40°C~125°C TJ
Packaging	Tape & Reel (TR)
Series	i.MX6DP
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	852MHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, DDR3L, DDR3
USB	USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces	CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers	HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant