MCIMX6G0DVM05ABR OverviewShipping overseas is convenient thanks to the embedded microprocessor's packaging in 289-LFBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TJ. In the i.MX6UL series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of LPDDR2, DDR3, DDR3L RAM controllers are used by this CPU. The microprocessor features interfaces EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART for better service. At 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V, the CPU runs its I/O.
MCIMX6G0DVM05ABR FeaturesARM® Cortex®-A7 Core
MCIMX6G0DVM05ABR ApplicationsThere are a lot of NXP USA Inc.
MCIMX6G0DVM05ABR Microprocessor applications.
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Factory Lead Time | 15 Weeks |
Package / Case | 289-LFBGA |
Operating Temperature | 0°C~95°C TJ |
Packaging | Tape & Reel (TR) |
Series | i.MX6UL |
Published | 2002 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Speed | 528MHz |
Core Processor | ARM® Cortex®-A7 |
Voltage - I/O | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR2, DDR3, DDR3L |
USB | USB 2.0 + PHY (1) |
Additional Interfaces | EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers | LVDS |
RoHS Status | ROHS3 Compliant |