MCIMX6L2DVN10AC Overview
The microprocessor is convenient for international shipping since it is packaged in 432-TFBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~95°C TJ should be understood. This is part of the i.MX6SL series. The CPU is powered by a ARM® Cortex®-A9 core. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. This microprocessor features AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces to better serve its users. The CPU runs I/O at 1.2V 1.8V 3.0V. uPs/uCs/Peripheral ICs are a MICROPROCESSOR, RISC. A maximum supply current of 1.5V is available.
MCIMX6L2DVN10AC Features
ARM® Cortex®-A9 Core

MCIMX6L2DVN10AC Applications
There are a lot of NXP USA Inc.
MCIMX6L2DVN10AC Microprocessor applications.

Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle

Factory Lead Time	15 Weeks
Package / Case	432-TFBGA
Surface Mount	YES
Operating Temperature	0°C~95°C TJ
Packaging	Tray
Series	i.MX6SL
Published	2017
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Terminal Pitch	0.5mm
Time@Peak Reflow Temperature-Max (s)	40
JESD-30 Code	S-PBGA-B
Supply Voltage-Max (Vsup)	1.5V
Supply Voltage-Min (Vsup)	1.375V
Speed	1.0GHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.2V 1.8V 3.0V
Ethernet	10/100Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (3)
Additional Interfaces	AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
Length	13mm
Height Seated (Max)	1.1mm
RoHS Status	ROHS3 Compliant