MCIMX6L2EVN10ABR Overview
The embedded microprocessor has been packed in 432-TFBGA for convenient overseas shipping. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~105°C TA is determined. This is a member of the i.MX6SL series. With a core count of ARM® Cortex®-A9, this CPU is multicore. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. With its AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces, this microprocessor will be able to serve you better. The CPU runs at 1.2V 1.8V 3.0V when it comes to I/O.
MCIMX6L2EVN10ABR Features
ARM® Cortex®-A9 Core

MCIMX6L2EVN10ABR Applications
There are a lot of NXP USA Inc.
MCIMX6L2EVN10ABR Microprocessor applications.

Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
Washing machine
Microwave ovens
Home appliances
Home video and audio
Entertainment products

Factory Lead Time	15 Weeks
Package / Case	432-TFBGA
Operating Temperature	-40°C~105°C TA
Packaging	Tape & Reel (TR)
Series	i.MX6SL
Published	2002
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Speed	1.0GHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.2V 1.8V 3.0V
Ethernet	10/100Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (3)
Additional Interfaces	AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
RoHS Status	ROHS3 Compliant