MCIMX6L8DVN10ABR,NXP USA Inc. MCIMX6L8DVN10ABR supplier,NXP USA Inc. MCIMX6L8DVN10ABR priceIntegrated Circuits (ICs)
MCIMX6L8DVN10ABR,NXP USA Inc. MCIMX6L8DVN10ABR supplier,NXP USA Inc. MCIMX6L8DVN10ABR priceIntegrated Circuits (ICs)
MCIMX6L8DVN10ABR
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MCIMX6L8DVN10ABR
    Part Number:KY-MCIMX6L8DVN10ABR
    Mfr. Part No:MCIMX6L8DVN10ABR
    Mfr.:NXP USA Inc.
    Stock:3737
    Description: ARM® Cortex®-A9 Microprocessor i.MX6SL Series 432-TFBGA
    Data Sheet:MCIMX6L8DVN10ABR Datasheet
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  • MCIMX6L8DVN10ABR Overview
    The embedded microprocessor ships overseas conveniently packed in 432-TFBGA. A high level of reliability is provided by using an advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around 0°C~95°C TJ. i.MX6SL is its series number. Core-wise, this CPU has a ARM® Cortex®-A9 processor. It has LPDDR2, LVDDR3, DDR3 RAM controllers. A AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 1.2V 1.8V 3.0V.
    MCIMX6L8DVN10ABR Features
    ARM® Cortex®-A9 Core

    MCIMX6L8DVN10ABR Applications
    There are a lot of NXP USA Inc.
    MCIMX6L8DVN10ABR Microprocessor applications.

    Toys
    Robots
    Radio
    Television
    Heater/Fan
    Calculator
    Kindle
    Christmas lights
    3D printers
    Washing machine
    Factory Lead Time12 Weeks
    Package / Case432-TFBGA
    Operating Temperature0°C~95°C TJ
    PackagingTape & Reel (TR)
    Seriesi.MX6SL
    Published2002
    Part StatusActive
    Moisture Sensitivity Level (MSL)3 (168 Hours)
    Peak Reflow Temperature (Cel)NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
    Speed1.0GHz
    Core ProcessorARM® Cortex®-A9
    Voltage - I/O1.2V 1.8V 3.0V
    Ethernet10/100Mbps (1)
    Number of Cores/Bus Width1 Core 32-Bit
    Graphics AccelerationYes
    RAM ControllersLPDDR2, LVDDR3, DDR3
    USBUSB 2.0 + PHY (3)
    Additional InterfacesAC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
    Co-Processors/DSPMultimedia; NEON™ SIMD
    Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
    Display & Interface ControllersKeypad, LCD
    RoHS StatusROHS3 Compliant
    
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