MCIMX6Q5EYM10ADR OverviewPacked in 624-LFBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. The CPU has 4 Core 32-Bit cores/Bus width. Extended operating temperature around -20°C~105°C TJ. It comes from the i.MX6Q series. This CPU is cored with a ARM® Cortex®-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. This CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6Q5EYM10ADR FeaturesARM® Cortex®-A9 Core
MCIMX6Q5EYM10ADR ApplicationsThere are a lot of NXP USA Inc.
MCIMX6Q5EYM10ADR Microprocessor applications.
Measurement and control field
Automatic control
Equipment control
Instrument control
Consumer electronics products
Toys
Robots
Radio
Television
Heater/Fan
Factory Lead Time | 15 Weeks |
Package / Case | 624-LFBGA, FCBGA |
Operating Temperature | -20°C~105°C TJ |
Packaging | Tape & Reel (TR) |
Series | i.MX6Q |
Published | 2002 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Speed | 1.0GHz |
Core Processor | ARM® Cortex®-A9 |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 4 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
SATA | SATA 3Gbps (1) |
RoHS Status | ROHS3 Compliant |